- May 24, 2017 -
In 1941, the United States in the talc painting on copper paste for wiring, for the production of proximity fuze.
In 1943, Americans used the technology heavily in military radios.
In 1947, epoxy resins began to be used as manufacturing substrates. At the same time, NBS began to study printed circuit technology to form coils, capacitors, resistors and other manufacturing technologies.
In 1948, the United States officially recognized the invention for commercial use.
Since 1950s, transistors with relatively low heating capacity have greatly replaced the vacuum tubes, and printed circuit board technology has been widely adopted. At the time, etching film technology was the mainstream.
In 1950, Japan used glass substrates for wiring with silver paint; and phenolic phenolic paper based phenolic substrates (CCL) made of copper foil as wiring.
In 1951, the appearance of polyimide made the heat resistance of the resin further, and also made the polyimide substrate.
In 1953, Motorola developed a double sided plate for plating through holes. This method is also applied to the later multilayer circuit board.
Printed circuit boards were widely used 10 years later in 60s, and their technology is also maturing. Since the advent of Motorola's dual sided boards, multilayer printed circuit boards have begun to emerge, increasing the area ratio of wiring to substrate.
In 1960, V. Dahlgreen printed a flexible printed circuit board with a printed circuit foil attached to a thermoplastic plastic.
In 1961, Hazeltine Corporation of the United States referred to the plating through hole method to produce multilayer plates.
In 1967, a "Plated-up technology" was added".
In 1969, FD-R made flexible printed circuit boards with polyimide.
In 1979, Pactel published the "Pactel" method for adding layers".
In 1984, NTT developed the Copper Polyimide method for thin film circuits".
In 1988, SIEMENS developed an additional layer of printed circuit board for Microwiring Substrate.
In 1990, IBM developed a "layer by layer circuit" (Surface, Laminar, Circuit, SLC) layer of printed circuit boards.
In 1995, Panasonic developed layer by layer printed circuit boards for ALIVH.
In 1996, Toshiba developed layer by layer printed circuit boards for B2it.
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