LED Tube Light Gold Flexible Bulb PCB Board

Electronics Led Tube Light Soft gold flexible round bulb pcb board 1.Product introduction Professional ability: More than 500 workers, over 4,000m2 for day-output and 1,000,000m2 for year-output. Advantage: 1. the whole production line and sales team, advanced processed devices, and checking and...

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Product Details

 Led Tube Light Soft gold flexible round bulb pcb board


1.Product introduction

Professional ability:

More than 500 workers, over 4,000m2 for day-output and  1,000,000m2 for year-output.

Advantage:

1. the whole production line and sales team, advanced processed devices, and checking and testing technology equipment.

2. Material: We have FR4 TG135/TG158/TG180 normal material in stock, also have FR1/ FR2/ FR3/ CEM1/ CEM3/ ROGERS/ ARLON/ ISOLA.

3. Rigid / flex/ flex-rigid PCBs with UL approved.

4. Cooperator: TCL, Gree, FOSS, BYD Auto and Gospell etc.

5. Quickly offer will be less then 4 hours, Some top urgent inquiry we can offer within 1hour.

 

2. Product Specification

Item:

flexible round bulb pcb

Material:

Polyimide(Kapton) with gold finger

Surface finishing:

Soft gold

Min. Board    Thickness:

0.1mm(4mil)

Min hole size:

0.2mm

Profiling:

Punching, Routing, V-cut

Flaming rate:

UL-94V-0 PCB

Quality standard:

 IPC-CLASSII /IPC-CLASSIII

Certificate:

 TS16949:2002, UL, ROHS, CE

Performance Test:

100% electrical and electricity performance test

Clolor

Yellow coverlayer, White silkscreen


3. Noeya FPC Board Manufacture Capibility 

No.


Item

Standard

Advanced

Comment







1


FCCL (adhesive)

Shengyi SF305:PI=0.5mil&1mil&2mil; Cu=0.33oz&0.5oz & 1oz

/











Panasonic R‐F775:PI=1mil&2mil&3mil;

Cu= 0.5oz&1oz

PI=3mil; Cu=2oz


2


FCCL (adhesiveless)





Taiflex MHK: PI=1mil&2mil,

Cu=0.33oz&0.5oz&1oz












DuPont Pyralux AP:PI=1mil,&2mil&3mil;

Cu= 0.5oz &1oz

PI= 4mil; Cu=2oz



Material





3

Coverlay

Shengyi SF305C: 0515&0525&1025&2030

/







Taiflex FHK: 1025&2035

/












4


Adhesive

Taiflex BT: AD=10um,

25um and 40um

/








5


PI stiffener

Taiflex MHK: PI=3mil&5mil&7mil&9mil

/








6


3M

9077&6677&9058

/








7


Design software

CAM350&PROTEL&

PADS&POWERPCB&

AUTOCAD&

GENESIS&ORCAD

/








8


Gerber format

RS‐274‐D、RS‐274‐X

/








9


Drill format

EXCELLON format

/








10


Layer

1‐4

5‐8








11


Board thickness (without stiffener)

0.05‐0.5mm

0.5‐0.8mm








12


Tolerance of single layer

±0.05mm

±0.03mm

without stiffener







13


Tolerance of double‐layer(≤ 0.3mm)

±0.05mm

±0.03mm

without stiffener







14


Tolerance of multi‐layer(<0.3mm)

±0.05mm

±0.03mm

without stiffener







15


Tolerance of multi‐layer(0.3mm‐0.8mm)

±0.1mm

±10%

without stiffener







16


Tolerance of board thickness(including PI stiffener)

±0.05mm

±10%



Others





17

Tolerance of board thickness(including FR4 stiffener)

±0.1mm

±10%










18


Min. board size

5*10mm(without birdge);

10mm*10mm(with bridge)

4*8mm(withoutbirdge);

8mm*8mm(with bridge)








19


Max. board size

9*14inch

9*23inch(PI≥1mil)








20


Impedance control tolerance

Single‐ended: ±5Ω(≤ 50Ω),±10%(>50Ω)

Single‐ended: ±3Ω(≤ 50Ω),±8%(>50Ω)







Differential: ±5Ω(≤ 50Ω),±10%(>50Ω)

Differential: ±4Ω

(≤ 50Ω),±8%(>50Ω)












21


Min. coverlay bridge

8mil

/








22


Min. bend radius of single layer

3‐6 times of board thickness

/








23


Min. bend radius of double‐layer

6‐10 times of board thickness

/








24


Min. bend radius of multi‐layer

10‐15times of board thickness

/








25


Min. dynamic bend radius

20‐40 times of board thickness

/

single layer







26


Min. line width/spacing (12/18um copper)

3.0/3.2mil(loop lines 6.0/6.2mil )

2.8/2.7mil(loop lines 5/5.2mil)








27

Inner layer

Min. line width/spacing (35um copper)

4.0/4.0mil(loop lines 8.0/8.0mil)

3.5/3.5mil(loop lines 7/7mil)







28

Min. line width/spacing (70um copper)

6/6.5mil(loop lines 10/10.5mil)

5/6mil(loop lines 9/9.5mil)










29


Max. copper thickness

2oz

3oz








30


Min. line width/spacing (18um copper)

3/3.2mil(loop lines 6/6mil)

2.8/2.7mil(loop lines 5.5/5.5mil)








31

Outer

Min. line width/spacing (35um copper)

4/4.5mil(loop lines 8/8.5mil)

3.5/3.5mil(loop lines 7.5/7.5mil)







32

Min. line width/spacing (70um copper)

6/7mil(loop lines 10/11mil)

5.5/8.5mil(loop lines 9.5/10.0mil)


layer







33

Min. line width/spacing (105um copper)

10/13mil(loop lines 12/15mil)

9.5/12.5mil(loop lines 11.5/14.5mil)










34


Max. finished copper thickness

3oz

5oz











6mil (<4 layer)

5mil (<4 layer)


35


Min. distance between via and conductors




Drilling

8mil (4~6 layer )

7mil (4~6 layer )









12mil (7‐8 layer )

10mil (7‐8 layer )












36


Min. mechanical drill hole

6mil

4mil








37

Solder

Solder mask color

green

/







38

Min. solder dam (base copper ≤ 1oz)

4mil(green), 8.0mil(solder dam on the large copper)

/


mask and







39

Min. clearance

3mil(part for 2.5mil)

/


silk screen


40

Silk color

white, yellow

/










41


Surface treatment

HASL ,ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold, Hard gold,

Immersion tin



Immersion silver and OSP







42


Mixed surface treatment

ENIG+OSP,ENIG+G/F

/








43


Gold thickness (ENIG)

0.05‐0.10um

/








44


Nickel thickness (ENIG)

3‐6um

/








45


Gold thickness (ENEPIG)

0.05‐0.10um

/



Surface





46

Palladium thickness (ENEPIG)

0.05‐0.15um

/





treatment





47

Nickel thickness (ENEPIG)

3‐6um

/








48


Electrolytic Nickel thickness

3‐6um

/








49


Electrolytic Gold thickness

0.05‐0.10um

/








50


Hard gold thickness(including lead)

0.1‐1.5um

/








51


OSP thickness

0.1‐0.3um

/








52


Immersion silver thickness

0.2‐0.4um

/








53

Routing

Laser accuracy

±0.05mm

/







54

Punch accuracy

±0.05mm ‐ ±0.15mm

/











4. Noeya Advantages:

1) Intermational Certifate :

image001.png


2) Strict Quality Control

image003.png


3) Better Raw Meterials:

image004.png


5. Packaging,Shipping and Payment of Ceramic PCB Board:

1) Packaging (Our Aim: Protect your products and save your shipping cost as best)

image006.png

Defalt package: Bubble, foam and K=K carton box. 

Customized package: Bubble bag, anti-static bag, cardboard, carton box with customized logo.

 

2)Shipping:(Accept customer choose other suitable ship way)

image008.jpg


Samples: DHL/UPS/FEDEX/TNT/EMS with short delivery time 2-4 working days.  

Mass production: Air/Sea transportation with low shipping cost.


3)Payment

image010.jpg


6. FAQ:

Q1:What is your testing policy and how you controle the quality?

A1:  For sample, usually tested by flying probe; for PCB Volume over 3 square meters, usually tested by fixture, this will be more faster. Due to there’s many steps to PCB production, we usually do inspection after every step.

Q2:What is your certificate?

A2:  ISO/TS16949, ISO14001: 2004, UL, SGS, RoHS report. We can provide the report of raw material based on customer’s requirement.

Q3: What is the lead time?

A3:  Sample needs 2-4 working days, mass production needs 7-10 working days. It depends on the files and quantity. 

Q4: Do you keep our information and files secret?

A4:  Keeping secret for customers is the basic principle of our factory. We can sign with the NDA with you.

Q5:  What files should we offer?

A5:  If only need PCBs, please provide Gerber File and manufacturing specifications; If need PCBA,Please provide Gerber File, Manufacturing specification, BOM list and Pick & Place/XY file.

Q6: Can we visit your company?

A6:  No problem. You are welcome to visit us in Shenzhen. And the other factory is in Meizhou City.

Q7: Can I get a sample?

A7:  Yes, It's reasonable to get a sample to test our quality at first. But you have to pay for the samples, and we will return all of the sample cost when the order is more than 20 sqm.

Q8:  Why choose us?

A8: 15 years experience in PCB manufacturing and PCB Assembly

       ISO9001, TS16949, UL Approval and RoHS compliant

       One-stop solution for PCB design, quick-turn prototyping, components sourcing, SMT & Through-hole assembly,

       Functional testing, Enclosure assembly.

       Full Range of Testing Services:Visual and AOI Inspection, In Circuit Testing, X-Ray for BGA and Functional Testing.


 


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