Transparent RGB Flexible 94V0 PCB for LED

Transparent RGB Flexible PCB 94v0 Circuit Board for LED TV 1. Product introduction : Noeya Technology Co.,Ltd is a hi-tech enterprise which specializes in producing variety, medium volume, customized multilayer FPC Board with RoHS, UL, ISO, SGS certification. We are looking forward to be your...

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Product Details

Transparent RGB Flexible 94V0 PCB for LED


1. Product introduction :

Noeya Technology Co.,Ltd is a hi-tech enterprise which specializes in producing variety, medium volume, customized multilayer FPC Board with RoHS, UL, ISO, SGS certification. We are looking forward to be your qualified supplier!


2. Product Specification :

Item:

Double-sided, Multilayers (max 8 layers) FPC

Material:

Polyimide(Kapton), Polyester(PET), 0.2MM, 1OZ copper foil, with gold finger

Surface finishing:

HASL Lead free/ENIG/Immersion silver/OSP/Gold plating /Electroless nickel immersion gold

Solder Mask    Types:

Green, Yellow, Black, White, Blue, Red, Clear

Max. Board Size

400mm x 800mm(15.8" x 31.5")

Min. Board  Thickness:

0.1mm(4mil)

Min hole size:

0.2mm

Min hole trace and space:

5mil/5mil

Profiling:

Punching, Routing, V-cut

Flaming rate:

UL-94V-0 PCB

Quality standard:

 IPC-CLASSII /IPC-CLASSIII

Certificate:

 TS16949:2002, UL, ROHS, CE

Performance Test:

100% electrical and electricity performance test

Application

 LED TV


3. Noeya FPC Board Manufacture Capibility

No.

 

Item

Standard

Advanced

Comment

 

 

 

 

 

 

1

 

FCCL (adhesive)

Shengyi SF305:

PI=0.5mil&1mil&2mil; Cu=0.33oz&0.5oz & 1oz

/

 

 

 

 

 

 

 

 

 

 

Panasonic R‐F775:PI=1mil&2mil&3mil;

Cu= 0.5oz&1oz

PI=3mil; Cu=2oz

 

2

 

FCCL (adhesiveless)

 

 

 

 

Taiflex MHK: PI=1mil&2mil,

Cu=0.33oz&0.5oz&1oz

 

 

 

 

 

 

 

 

 

 

 

DuPont Pyralux AP:PI=1mil,&2mil&3mil;

Cu= 0.5oz &1oz

PI= 4mil; Cu=2oz

 

 

Material

 

 

 

 

3

Coverlay

Shengyi SF305C: 0515&0525&1025&2030

/

 

 

 

 

 

 

Taiflex FHK: 1025&2035

/

 

 

 

 

 

 

 

 

 

 

 

4

 

Adhesive

Taiflex BT: AD=10um,

25um and 40um

/

 

 

 

 

 

 

 

5

 

PI stiffener

Taiflex MHK: PI=3mil&5mil&7mil&9mil

/

 

 

 

 

 

 

 

6

 

3M

9077&6677&9058

/

 

 

 

 

 

 

 

7

 

Design software

CAM350&PROTEL&

PADS&POWERPCB&

AUTOCAD&

GENESIS&ORCAD

/

 

 

 

 

 

 

 

8

 

Gerber format

RS‐274‐D、RS‐274‐X

/

 

 

 

 

 

 

 

9

 

Drill format

EXCELLON format

/

 

 

 

 

 

 

 

10

 

Layer

1‐4

5‐8

 

 

 

 

 

 

 

11

 

Board thickness (without stiffener)

0.05‐0.5mm

0.5‐0.8mm

 

 

 

 

 

 

 

12

 

Tolerance of single layer

±0.05mm

±0.03mm

without stiffener

 

 

 

 

 

 

13

 

Tolerance of double‐layer(≤ 0.3mm)

±0.05mm

±0.03mm

without stiffener

 

 

 

 

 

 

14

 

Tolerance of multi‐layer(<0.3mm)

±0.05mm

±0.03mm

without stiffener

 

 

 

 

 

 

15

 

Tolerance of multi‐layer(0.3mm‐0.8mm)

±0.1mm

±10%

without stiffener

 

 

 

 

 

 

16

 

Tolerance of board thickness(including PI stiffener)

±0.05mm

±10%

 

 

Others

 

 

 

 

17

Tolerance of board thickness(including FR4 stiffener)

±0.1mm

±10%

 

 

 

 

 

 

 

 

 

18

 

Min. board size

5*10mm(without birdge);10mm*10mm(with bridge)

4*8mm(withoutbirdge);

8mm*8mm(with bridge)

 

 

 

 

 

 

 

19

 

Max. board size

9*14inch

9*23inch(PI≥1mil)

 

 

 

 

 

 

 

20

 

Impedance control tolerance

Single‐ended: ±5Ω(≤ 50Ω),±10%(>50Ω)

Single‐ended: ±3Ω(≤ 50Ω),±8%(>50Ω)

 

 

 

 

 

 

Differential: ±5Ω(≤ 50Ω),±10%(>50Ω)

Differential:

±4Ω(≤ 50Ω),±8%(>50Ω)

 

 

 

 

 

 

 

 

 

 

 

21

 

Min. coverlay bridge

8mil

/

 

 

 

 

 

 

 

22

 

Min. bend radius of single layer

3‐6 times of board thickness

/

 

 

 

 

 

 

 

23

 

Min. bend radius of double‐layer

6‐10 times of board thickness

/

 

 

 

 

 

 

 

24

 

Min. bend radius of multi‐layer

10‐15times of board thickness

/

 

 

 

 

 

 

 

25

 

Min. dynamic bend radius

20‐40 times of board thickness

/

single layer

 

 

 

 

 

 

26

 

Min. line width/spacing (12/18um copper)

3.0/3.2mil(loop lines 6.0/6.2mil )

2.8/2.7mil(loop lines 5/5.2mil)

 

 

 

 

 

 

 

27

Inner layer

Min. line width/spacing (35um copper)

4.0/4.0mil(loop lines 8.0/8.0mil)

3.5/3.5mil(loop lines 7/7mil)

 

 

 

 

 

 

28

Min. line width/spacing (70um copper)

6/6.5mil(loop lines 10/10.5mil)

5/6mil(loop lines 9/9.5mil)

 

 

 

 

 

 

 

 


29

 

Max. copper thickness

2oz

3oz

 

 

 

 

 

 

 

30

 

Min. line width/spacing (18um copper)

3/3.2mil(loop lines 6/6mil)

2.8/2.7mil(loop lines 5.5/5.5mil)

 

 

 

 

 

 

 

31

Outer

Min. line width/spacing (35um copper)

4/4.5mil(loop lines 8/8.5mil)

3.5/3.5mil(loop lines 7.5/7.5mil)

 

 

 

 

 

 

32

Min. line width/spacing (70um copper)

6/7mil(loop lines 10/11mil)

5.5/8.5mil(loop lines 9.5/10.0mil)

 

layer

 

 

 

 

 

 

33

Min. line width/spacing (105um copper)

10/13mil(loop lines 12/15mil)

9.5/12.5mil(loop lines 11.5/14.5mil)

 

 

 

 

 

 

 

 

 

34

 

Max. finished copper thickness

3oz

5oz

 

 

 

 

 

 

 

 

 

 

6mil (<4 layer)

5mil (<4 layer)

 

35

 

Min. distance between via and conductors

 

 

 

Drilling

8mil (4~6 layer )

7mil (4~6 layer )

 

 

 

 

 

 

 

 

12mil (7‐8 layer )

10mil (7‐8 layer )

 

 

 

 

 

 

 

 

 

 

 

36

 

Min. mechanical drill hole

6mil

4mil

 

 

 

 

 

 

 

37

Solder

Solder mask color

green

/

 

 

 

 

 

 

38

Min. solder dam (base copper ≤ 1oz)

4mil(green), 8.0mil(solder dam on the large copper)

/

 

mask and

 

 

 

 

 

 

39

Min. clearance

3mil(part for 2.5mil)

/

 

silk screen

 

40

Silk color

white, yellow

/

 

 

 

 

 

 

 

 

 

41

 

Surface treatment

HASL ,ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold, Hard gold,

Immersion tin

 

 

Immersion silver and OSP

 

 

 

 

 

 

42

 

Mixed surface treatment

ENIG+OSP,ENIG+G/F

/

 

 

 

 

 

 

 

43

 

Gold thickness (ENIG)

0.05‐0.10um

/

 

 

 

 

 

 

 

44

 

Nickel thickness (ENIG)

3‐6um

/

 

 

 

 

 

 

 

45

 

Gold thickness (ENEPIG)

0.05‐0.10um

/

 

 

Surface

 

 

 

 

46

Palladium thickness (ENEPIG)

0.05‐0.15um

/

 

 

 

 

treatment

 

 

 

 

47

Nickel thickness (ENEPIG)

3‐6um

/

 

 

 

 

 

 

 

48

 

Electrolytic Nickel thickness

3‐6um

/

 

 

 

 

 

 

 

49

 

Electrolytic Gold thickness

0.05‐0.10um

/

 

 

 

 

 

 

 

50

 

Hard gold thickness(including lead)

0.1‐1.5um

/

 

 

 

 

 

 

 

51

 

OSP thickness

0.1‐0.3um

/

 

 

 

 

 

 

 

52

 

Immersion silver thickness

0.2‐0.4um

/

 

 

 

 

 

 

 

53

Routing

Laser accuracy

±0.05mm

/

 

 

 

 

 

 

54

Punch accuracy

±0.05mm ‐ ±0.15mm

/

 

 

 

 

 

 

 

 



 

 

 

4. Noeya Advantages:

1) Intermational Certifate :

image001.png 


2) Strict Quality Control Process:

image003.png 

3) Better Raw Meterials:

image006.jpg


5. Packaging,Shipping and Payment of Multilayer FPC :

1) Packaging (Our Aim: Protect your products and save your shipping cost as best)

image007.png 

Defalt package: Bubble, foam and K=K carton box. 

Customized package: Bubble bag, anti-static bag, cardboard, carton box with customized logo.

 

2)Shipping:(Accept customer choose other suitable ship way)

image008.png

Samples: DHL/UPS/FEDEX/TNT/EMS with short delivery time 2-4 working days.  

Mass production: Air/Sea transportation with low shipping cost.

 

3)Payment

image011.jpg


6. FAQ:

Q: What kind of PCB you can provide ? 
A: Rigid PCB, FPC, Rigid-flex PCB. 
Q: Can you provide free sample of FPC ? 
A: Yes, sample fee will be refunded when place mass order. 
Q: What I need to provide for Multilayer FPC production ? 
A: Gerber file, Specification(includes base material, finished thickness, copper thickness, surface finishing, etc.) and Quantity
Q: I only have the FPC sample, not FPC file, can you produce it for me? 
A: Yes, we can copy file based on your sample board, this file names gerber, and production then is accorded to gerber file. 
Q: What is your FPCtest standard ? 
A: IPC class 2 or 3. 
Q: What's your standard lead time of FPC? 
A: In general, 4 working days for prototyping, 8-15 working days for mass production.


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